1. Internal Flash Die Revision/Lot Change: The suffix change from “AAA0” to “ABA0” most critically indicates a different revision or production lot of the internal NAND Flash die. While both share the same density, speed grade, and SLC technology, the underlying silicon die may originate from a different fabrication node or an optimized version. 2. Implications for Higher Long-Term Reliability and Consistency: Such a change typically represents an internal component upgrade by the manufacturer to improve yield, data retention, or long-term endurance. The “ABA0” version likely incorporates further screened or process-optimized die, offering more stable performance, a lower raw bit error rate, or enhanced data integrity across extreme temperature ranges. This explains its significantly higher price compared to the “AAA0” version, with the premium reflecting the added reliability value. 3. Impact on Substitution: For consumer or general industrial applications, the substitution may be transparent. However, for demanding applications such as automotive, medical, or high-reliability industrial control systems, it is essential to evaluate whether the new version meets the specific requirements for long-term data retention, endurance cycles, and full-temperature-range performance. Direct substitution may carry unverified long-term reliability risks.