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Original Part

Video Amp 2 Current Feedback 8-SOIC

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Alternative Part

Current Feedback Amplifier 2 Circuit 8-SO PowerPad

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Current Feedback Amplifier 2 Circuit 8-SOIC

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1. THS3112IDDAR Substitution Conclusion This device can serve as a replacement, but key differences and thermal design must be considered. Both the THS3112IDDAR and the HA5023IBZ96 are dual-channel current‑feedback amplifiers. However, the THS3112IDDAR offers slightly lower bandwidth (110 MHz vs. 125 MHz), which may affect very‑high‑frequency response. Its slew rate is significantly higher (1550 V/µs vs. 350 V/µs), providing substantially improved high‑speed signal handling, making it suitable for fast transient waveforms. The output current capability is much stronger (270 mA vs. 20 mA), enabling direct drive of heavy loads. The supply range is compatible (±5 V to ±15 V vs. ±4.75 V to 18 V), though the minimum supply voltage is slightly higher; verify that the system’s lowest voltage meets this requirement. Additionally, the THS3112IDDAR uses a PowerPAD package with an exposed thermal pad, offering better thermal performance than a standard SOIC. However, this necessitates designing thermal vias on the PCB and imposes stricter layout constraints.
2. THS3112ID Substitution Conclusion This device is also a viable substitute, but the application scenario should be evaluated. The THS3112ID shares identical electrical parameters with the IDDAR version; the only difference is its package—a standard 8‑SOIC without a thermal pad. Therefore, its advantages and disadvantages in bandwidth, slew rate, output current, etc., align with the conclusions above. Due to the absence of the PowerPAD, its thermal dissipation capability is weaker under sustained high‑output‑current or high‑temperature conditions, which may limit stable performance in demanding drive applications. It is better suited for medium‑to‑low load scenarios or applications with favorable thermal conditions. If the original HA5023IBZ96 operates at elevated temperatures or under high load, directly replacing it with the THS3112ID could pose thermal reliability risks. Derating or optimized layout compensation may be necessary.
Analysis ID: 0ED0-4086000
Based on part parameters and for reference only. Not to be used for procurement or production.
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