The feasibility assessment for substituting the original part 74ABTH162245ADL,11 with the SN74ABT16245ADGG concludes that the replacement is functionally viable and offers performance enhancements, provided that PCB layout modifications are permitted. However, it is not a pin-compatible "drop-in replacement." Key differences are as follows: First, the output drive capability differs. The TI part features a significantly higher low-level output current (64 mA) compared to the Nexperia part (12 mA). This grants the TI device stronger sink current capability when driving low-level signals, which improves signal integrity and enables driving of heavier loads—representing a performance upgrade. Second, the physical packages differ. The original part uses a 48-BSSOP package with a width of 7.50 mm, while the TI part uses a 48-TSSOP package with a width of 6.10 mm. The package outlines and pin pitch may vary, preventing direct soldering onto the original footprints. Redesigning the PCB layout is therefore the primary hardware modification required to implement this substitution.