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Original Part

Diode Array 1 Pair Common Cathode 100 V 15A Through Hole TO-220-3

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Alternative Part

Diode Array 1 Pair Common Cathode 100 V 15A Through Hole TO-220-3

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Substitution Feasibility Conclusion

In the vast majority of general applications, the V30100C-M3/4W can serve as a direct replacement for the MBR30H100CTG. However, the impact of reverse leakage current and operating temperature on the specific application must be evaluated, particularly in high-temperature or low-power designs.

Comparison Points

1. Reverse Leakage Current (Key Electrical Difference) - MBR30H100CTG: 4.5 µA @ 100 V - V30100C-M3/4W: 500 µA @ 100 V - The Vishay device exhibits approximately 100 times higher leakage current, which may lead to increased static power dissipation. This is especially significant under high-temperature or high-voltage conditions. Designs sensitive to efficiency or targeting low power consumption should validate this parameter carefully. 2. Operating Temperature Range and Qualification - MBR30H100CTG: Maximum junction temperature (Tj) of 175°C; no automotive-grade qualification noted. - V30100C-M3/4W: Junction temperature (Tj) of 150°C; AEC-Q101 qualified. - The onsemi device offers greater theoretical thermal headroom, making it suitable for higher-temperature environments. The Vishay device meets automotive reliability requirements but has a lower temperature ceiling; thermal management must ensure compliance with derating guidelines. 3. Technology Platform and Series Positioning - MBR30H100CTG belongs to the SWITCHMODE™ series, optimized for switching power supply applications. - V30100C-M3/4W utilizes TMBS® (Trench MOS Barrier Schottky) technology, emphasizing low forward voltage drop and high-temperature stability. - TMBS technology can theoretically offer lower conduction losses, but a practical assessment must weigh this benefit against the trade-off in leakage current.
Analysis ID: 2C98-75A5000
Based on part parameters and for reference only. Not to be used for procurement or production.
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