Original Part
Diode Array 1 Pair Common Cathode 150 V 10A Through Hole TO-220-3 Full Pack, Isolated Tab

Alternative Part
Diode Array 1 Pair Common Cathode 150 V 10A Through Hole TO-220-3 Full Pack

Substitution Feasibility Conclusion
In most conventional applications, the MBRF20H150CTG can serve as a replacement for the SBR20U150CTFP. However, it offers significant optimizations in electrical performance. Designers must also account for potential changes due to differences in operating temperature range and physical package details.
Comparison Points
1. Core Technology:
SBR20U150CTFP: Utilizes Super Barrier Rectifier (SBR®) technology.
MBRF20H150CTG: Employs conventional Schottky technology.
SBR technology is essentially an enhanced form of Schottky diode, designed to balance low forward voltage drop and low reverse leakage current. The MBR part uses a more mature, conventional Schottky process. Its measured parameters (see below) are typically superior, but its high-temperature leakage characteristics may not match the ideal claims of SBR technology. This fundamental technological difference drives the subsequent electrical parameter variations.
2. Key Electrical Performance (Vf & Ir):
Forward Voltage Drop (Vf @ 10A): SBR: 780mV, MBR: 680mV.
The MBR exhibits significantly lower conduction loss (approximately 13% lower), resulting in reduced heat generation at the same current and higher system efficiency. This is the core value justifying its higher price.
Reverse Leakage Current (Ir @ 150V): SBR: 500µA, MBR: 50µA.
At the rated voltage, the MBR's reverse leakage is only one-tenth that of the SBR. This indicates superior reverse blocking characteristics, which helps reduce power consumption in standby or off states and benefits thermal stability at elevated temperatures.
3. Operating Junction Temperature Range (Tj):
SBR: -65°C to 175°C
MBR: -20°C to 150°C
The SBR's maximum junction temperature is 25°C higher, providing greater thermal design margin and enhanced reliability in high-ambient-temperature or thermally constrained applications. The MBR's 150°C limit is typical for standard Schottky diodes; system design must ensure this limit is not exceeded.
4. Package and Mounting:
SBR: Explicitly labeled with "Isolated Tab."
MBR: No isolation specified; the TO-220FP package is typically non-isolated.
The SBR can be mounted directly to a heatsink without an insulating washer, simplifying assembly and potentially lowering thermal resistance. When substituting with the MBR, the electrical isolation requirement for the heatsink must be verified. If isolation is needed, additional insulating washers and sleeves are necessary, which will increase interface thermal resistance and impact heat dissipation performance.
5. Price:
The MBR (approx. $3.09) is about 68% more expensive than the SBR (approx. $1.84).
Substitution requires a trade-off between performance gains (efficiency, leakage) and the increased component cost, along with potential additional costs for thermal interface changes. In cost-sensitive applications where performance demands are not extreme, a direct replacement may not be economically justified.
Analysis ID: 09E2-2019000
Based on part parameters and for reference only. Not to be used for procurement or production.
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