Original Part
Transceiver, Non-Inverting 2 Element 8 Bit per Element 3-State Output 48-TSSOP
Alternative Part
Transceiver, Non-Inverting 2 Element 8 Bit per Element 3-State Output 48-SSOP
Transceiver, Non-Inverting 2 Element 8 Bit per Element 3-State Output 48-SSOP
1. CY74FCT16245ATPVC Substitution Conclusion
Substitution is feasible, subject to a package compatibility review. Key differences are as follows: First, the output drive capability differs. The TI device offers significantly higher current drive (32 mA high / 64 mA low) compared to the original Renesas part (24 mA). While this provides better performance when driving heavy loads or long traces, the original circuit must be rechecked if it relies on precise current limiting—for instance, if low-value pull-up resistors are used—to avoid potential overcurrent conditions. Second, the package outline dimensions differ. TI’s 48-BSSOP package (7.50 mm wide) is 1.4 mm wider than the original 48-TFSOP (6.10 mm wide). If the existing PCB layout is tight, especially in the width direction, physical installation may not be possible. The footprint area and clearance to adjacent components must be verified. Beyond these points, core logic functionality and supply voltage are fully compatible. Direct substitution is acceptable provided the package is mechanically compatible.
2. CY74FCT16245ATPVCT Substitution Conclusion
The substitution conclusion is identical to that for the CY74FCT16245ATPVC above. The same differences apply: higher output drive current (32 mA / 64 mA vs. 24 mA / 24 mA) and a wider package (7.50 mm vs. 6.10 mm). In TI’s part numbering convention, the suffix “T” typically denotes only the tape-and-reel packaging format and does not indicate any change in electrical parameters or package dimensions. Therefore, the CY74FCT16245ATPVCT is electrically and mechanically identical to the CY74FCT16245ATPVC, and the substitution assessment relative to the original part is exactly the same. Once package width compatibility is confirmed, this device can also serve as a direct replacement, and its tape-and-reel packaging may be better suited for automated SMT assembly.
Analysis ID: 7268-E080000
Based on part parameters and for reference only. Not to be used for procurement or production.
SkyChip © 2026, Email: sales@skychip.com