Original Part
Transceiver, Non-Inverting 2 Element 8 Bit per Element 3-State Output 48-SSOP
Alternative Part
Transceiver, Non-Inverting 2 Element 8 Bit per Element 3-State Output 48-SSOP
Transceiver, Non-Inverting 2 Element 8 Bit per Element 3-State Output 48-TSSOP
1. CY74FCT162245CTPVC Substitution Conclusion
The CY74FCT162245CTPVC is largely compatible with the original part 74FCT16245ETPVG as a drop-in replacement in terms of logic function, supply voltage (4.5V to 5.5V), and package (48-BSSOP). However, a key difference exists in the output drive capability: the original device provides 32mA high-level and 64mA low-level output currents, whereas the TI part offers a symmetrical 24mA drive for both high and low levels. The weaker drive strength of the CY74FCT162245CTPVC may be insufficient for applications demanding high current drive under heavy loads or for high-speed bus interfaces. This could lead to signal integrity degradation or timing issues when driving multiple loads or long transmission lines. In systems with light loading and less stringent drive current requirements, this part can serve as a valid substitute. However, if the original design relies on the high drive capability—particularly the 64mA low-level current for fast signal pull-down—the substitution is not feasible, and the actual load conditions must be carefully evaluated.
2. CY74FCT16245ATPACT Substitution Conclusion
The CY74FCT16245ATPACT fully matches the original part 74FCT16245ETPVG in logic function, supply voltage, and output drive current (32mA high / 64mA low), ensuring identical electrical performance and drive capability. The difference lies in the package footprint: the original device uses a 48-BSSOP package (7.50mm wide), while the TI part is housed in a 48-TFSOP/TSSOP package (6.10mm wide). The thinner, more compact package saves PCB space but may present challenges due to finer pin pitch, which can complicate soldering and heat dissipation. Additionally, the PCB layout must be redesigned to accommodate the different package outline and thermal characteristics. If the application allows for a package change and PCB adaptability—such as adjusting trace routing and pad geometry—this device can be an effective substitute. Otherwise, direct replacement in existing hardware may introduce mechanical compatibility issues and should be evaluated with caution.
Analysis ID: 1963-A01C000
Based on part parameters and for reference only. Not to be used for procurement or production.
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