Original Part
SRAM - Synchronous, SDR (ZBT) Memory IC 9Mbit Parallel 8.5 ns 165-CABGA (13x15)
Alternative Part
SRAM - Synchronous, SDR (ZBT) Memory IC 9Mbit Parallel 150 MHz 3.8 ns 165-CABGA (13x15)
SRAM - Synchronous, SDR Memory IC 9Mbit Parallel 117 MHz 7.5 ns 165-TFBGA (13x15)
1. 71V65603S150BQGI8 Substitution Conclusion
From an electrical and hardware interface perspective, this part number represents a direct, high-performance drop-in replacement. It belongs to the same family of synchronous ZBT SRAMs from Renesas as the original component, with identical core specifications: the same 9Mbit (256K x 36) density, the same 3.3V operating voltage range, and a physically compatible 165-ball TBGA package. The key difference lies in speed: the substitute offers a significantly faster access time (3.8 ns) and clock frequency (150 MHz) compared to the original (8.5 ns). While delivering identical functionality, it enables higher data throughput bandwidth and faster system response. It should be noted that dynamic power consumption may increase accordingly, and the system board must be capable of reliably supporting the higher clock frequency.
2. IS64LF25636A-7.5B3LA3-TR Substitution Conclusion
In terms of basic functionality and density, this component can be considered as an alternative. However, critical differences in interface protocol and performance introduce a higher substitution risk, necessitating rigorous validation. It is compatible with the original part in memory capacity, organization, voltage, and pin count (165). The differences are twofold. First, the core technology standard differs: the ISSI part uses a standard synchronous SDR interface, whereas the original features a ZBT (Zero Bus Turnaround) interface. During transitions between consecutive read and write operations, the ISSI device may introduce wait states, potentially impacting bus efficiency. System timing and controller configuration would require re-matching. Second, there are performance and packaging details to consider. Its access time (7.5 ns) is slower than the original's, and it uses a TFBGA package. While the ball grid array pitch may be identical, the specific ball layout (BGA map) must be compared point-for-point against the original TBGA package to confirm full PCB layout compatibility.
Analysis ID: 8DBA-2465000
Based on part parameters and for reference only. Not to be used for procurement or production.
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