Original Part
Asynchronous FIFO 4.5K (512 x 9) Uni-Directional 50MHz 12ns 28-PDIP
Alternative Part
Asynchronous FIFO 9K (1K x 9) Uni-Directional 50MHz 12ns 28-SOIC
Substitution Feasibility Conclusion
Under the premise of meeting capacity upgrade and packaging process compatibility, the 7202LA12SOG can directly replace the 7201LA12TPG, but PCB design and production flow must be re-evaluated.
Comparison Points
1. Memory Capacity: The 7202LA12SOG offers 9Kb (1K x 9), doubling the 4.5Kb (512 x 9) of the 7201LA12TPG. Substitution doubles the system data buffer depth, accommodating higher data burst or latency processing demands. However, it is essential to ensure subsequent system logic does not experience unintended overflow or pointer errors due to the capacity difference.
2. Packaging and Process: The 7201LA12TPG uses a 28-PDIP (through-hole) package, while the 7202LA12SOG is a 28-SOIC (surface-mount) device. This impacts not only PCB layout (through-hole vs. SMD pads) but also shifts the production process from through-hole insertion to surface-mount soldering. This change may involve adjustments to production line equipment, thermal design optimization, and alterations in rework accessibility.
Analysis ID: A5E1-BE17000
Based on part parameters and for reference only. Not to be used for procurement or production.
SkyChip © 2026, Email: sales@skychip.com