1. CY74FCT16245ATPVC Substitution Conclusion The CY74FCT16245ATPVC can serve as a replacement for the original part 74FCT162245ATPAG8, but two key technical differences must be considered. First, the output drive current differs: the TI device provides 32 mA at a high level and 64 mA at a low level, whereas the original part offers a symmetrical 24 mA for both high and low levels. The TI device thus delivers stronger load‑driving capability, particularly in its higher low‑level current, which can support heavier loads or longer transmission lines. However, this may increase system power consumption and thermal design requirements; power‑budget planning should be verified accordingly. Second, there is a package difference: the TI part uses a 48‑BSSOP package (7.50 mm width), while the original is a 48‑TFSOP (6.10 mm width). Although pin‑outs are likely similar, the package dimensions and pad layouts are not directly compatible, requiring PCB footprint adjustment or redesign. Provided the application can accommodate these differences and the logic function and voltage range (4.5 V–5.5 V) match, substitution is feasible. Nevertheless, it is recommended to validate unspecified parameters such as timing and temperature range to ensure full system compatibility.