Original Part
Transceiver, Non-Inverting 2 Element 8 Bit per Element 3-State Output 48-TSSOP
Alternative Part
Transceiver, Non-Inverting 2 Element 8 Bit per Element 3-State Output 48-SSOP
Transceiver, Non-Inverting 2 Element 8 Bit per Element 3-State Output 48-SSOP
1. CY74FCT162245ATPVC Substitution Conclusion
From a core functionality and electrical parameter standpoint, the CY74FCT162245ATPVC can serve as a substitute for the original part 74FCT162245CTPAG. Both devices share identical logic type, bit width, output drive capability (24 mA), and operating voltage range (4.5 V to 5.5 V), ensuring equivalent basic logic function and load-driving performance in the circuit. The primary technical difference lies in the package: the original part is housed in a 48‑TFSOP (width 6.10 mm), while the TI device uses a 48‑BSSOP (width 7.50 mm). Due to the differing package outlines and board‑space requirements, direct drop‑in replacement on the PCB is not physically possible without reevaluating and modifying the board‑level footprint and pad layout. Provided PCB space permits and the layout is adjusted accordingly, substitution at the electrical and functional level is feasible.
2. CY74FCT162245TPVC Substitution Conclusion
The CY74FCT162245TPVC also offers functional feasibility for replacing the original 74FCT162245CTPAG. Its key specifications—logic type, bit structure, output current, and voltage—match the original part exactly. The difference between this device and the aforementioned ATPVC variant typically relates to performance grade (e.g., ATPVC may offer improved AC characteristics such as lower dynamic power or shorter propagation delay, though not indicated in the given parameters). However, the most critical and common distinction from the original part remains the package: both TI devices use a 48‑BSSOP (7.50 mm wide), which is incompatible with the original 48‑TFSOP (6.10 mm wide). The conclusion aligns with the previous case: functional replacement is straightforward, but physical mounting onto pads designed for TFSOP is impossible without PCB footprint adaptation. If this mechanical mismatch is disregarded, the substitution cannot be implemented.
Analysis ID: 930D-D99A000
Based on part parameters and for reference only. Not to be used for procurement or production.
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