(HKG) +86 755 8277 4696
WhatsAppWhatsApp
English
SkyChip
0
Original Part

Diode Array 1 Pair Common Cathode 45 V 15A Surface Mount TO-263-3, D2PAK (2 Leads + Tab), TO-263AB

quote
Alternative Part

Diode Array 1 Pair Common Cathode 45 V 15A Surface Mount TO-263-3, D2PAK (2 Leads + Tab), TO-263AB

quote

Substitution Feasibility Conclusion

The RBQ30NS45ATL is electrically and mechanically compatible as a drop-in replacement for the MBRB3045CTQ-TP. However, the impact of their differences on the specific application must be evaluated. Direct substitution is viable in most general-purpose scenarios, but caution is advised for cost-sensitive applications or those with high-temperature or high-reliability requirements.

Comparison Points

1. Reverse Leakage Current (Ir @ Vr): The RBQ30NS45ATL has a leakage of 200µA, which is double that of the MBRB3045CTQ-TP (100µA). Under high-temperature and high-reverse-voltage operating conditions, the Rohm device will exhibit higher static power dissipation, potentially generating more heat. This difference must be considered in circuits with stringent efficiency or thermal management requirements. 2. Price: The unit price of the RBQ30NS45ATL ($2.53) is approximately 71% higher than that of the MBRB3045CTQ-TP ($1.48). In cost-sensitive or high-volume applications, this substitution would significantly increase BOM cost. This difference is a key commercial factor in the replacement decision. 3. Certification & Standards: The MBRB3045CTQ-TP is explicitly marked as compliant with the AEC-Q101 standard and carries an "Automotive" grade. The RBQ30NS45ATL datasheet does not explicitly mention this certification. The MCC device is a standardized, AEC-Q101-qualified automotive-grade product, providing clear qualification assurance within the automotive supply chain. If intended for automotive or high-reliability industrial applications, using a device without explicit AEC-Q101 marking may require additional validation or pose supply chain qualification risks. 4. Supplier Package: The RBQ30NS45ATL is designated as "LPDS" (Low Profile Dual Schottky), a Rohm proprietary package technology name. It remains essentially pin-compatible with the standard D2PAK footprint. LPDS typically optimizes internal package structure and thermal resistance. While pin-compatible, its thermal performance may differ subtly from a standard D2PAK. It may offer slightly better performance in actual PCB thermal design, but a comparison based on specific thermal resistance (Rth(j-a)) parameters is necessary for confirmation. 5. Manufacturer & Series: The devices are from different manufacturers (MCC vs. Rohm) and belong to different product series. Differences may exist in long-term supply stability, product lifecycle, and technical support focus. Rohm possesses strong technical expertise in power semiconductors, while MCC may offer advantages in cost and supply flexibility for discrete components.
Analysis ID: DD11-E6D1000
Based on part parameters and for reference only. Not to be used for procurement or production.
SkyChip © 2026, Email: sales@skychip.com