1. Connection Interface Design - The BL variant features “wire leads,” whereas the BU variant employs a “busbar” connection. - Implication: The BU type is designed for high-integration, low-impedance busbar systems, making it suitable for high-current direct connections in fixed power distribution or battery systems, thereby reducing contact loss and heating. The BL type relies on flexible cabling, which is better suited for space-constrained applications or where vibration isolation is needed, though it introduces additional termination points and potential failure modes. 2. System Integration and Cost Structure - The BU variant is significantly more expensive (+35%), reflecting the manufacturing complexity of its integrated interface and the requirement for higher installation precision at the system level (e.g., busbar machining, alignment tolerances). - Implication: The BU type aims to reduce long-term system impedance and maintenance needs, but carries higher upfront installation costs. The BL type offers flexibility, but may introduce long-term reliability risks due to cable aging or terminal loosening. 3. Thermal Management and Mechanical Stress - The busbar connection (BU) provides a superior thermal conduction path and mechanical stability, which benefits heat dissipation during sustained high-current operation. The wire-lead connection (BL) may introduce localized thermal resistance due to cable insulation and termination points. - Implication: In applications with frequent switching or high vibration, the BU structure is more reliable. The BL type requires careful design of cable securing and thermal compensation. Recommendation: If the system already uses a busbar architecture, switching to the BL type would require adding cable adapters, which could impact current rating and safety. Conversely, if the original design is based on cabling, forcing a replacement with the BU type would necessitate a redesign of the busbar structure, incurring higher cost and risk. The selection should be based on the actual system integration approach, thermal conditions, and a full lifecycle cost assessment.