Original Part
Alternative Part
1. AD828ANZ Substitution Conclusion
The AD828ANZ is not a viable direct substitute for the LM358P. Although both are dual-channel operational amplifiers with overlapping supply voltage ranges, their core performance positioning is fundamentally different. The AD828ANZ is a high-speed, voltage-feedback op-amp featuring a -3dB bandwidth of 130MHz and a slew rate of 450V/µs. It is specifically designed for processing high-frequency or fast transient signals, such as video signals. However, this performance comes with a quiescent current of 14mA, resulting in significantly higher power consumption than the LM358P.
In contrast, the original LM358P is a general-purpose, industry-standard op-amp. It has a gain-bandwidth product of only 700kHz, a slew rate of 0.3V/µs, and a remarkably low quiescent current of 500µA (for both channels). Its key advantages are low power consumption, low cost, and a high-voltage swing output. It is well-suited for applications with minimal speed requirements, such as DC conditioning or amplifying low-frequency sensor signals.
A direct substitution would lead to unnecessary increases in power consumption and cost in low-speed applications. Conversely, in high-speed applications, the LM358P's performance would be entirely inadequate. Therefore, these two devices are not interchangeable.
2. LM358PWRG3 Substitution Conclusion
The LM358PWRG3 can serve as a direct electrical performance substitute for the LM358P, but attention must be paid to package compatibility. From a technical parameter standpoint, all key electrical specifications—including gain-bandwidth product, slew rate, input bias current, offset voltage, supply range, and output current—are identical. Their signal processing performance within a circuit is therefore exactly the same.
The primary difference lies in the package form factor. The original LM358P uses an 8-pin PDIP (plastic dual in-line package), intended for through-hole mounting. The LM358PWRG3, however, utilizes an 8-pin TSSOP (thin shrink small outline package), a surface-mount device (SMD).
If the original board is designed for a DIP socket or through-hole soldering, the TSSOP package cannot be physically installed. In such cases, the PCB must be redesigned to accommodate surface-mount pads, with corresponding adjustments to assembly and thermal management processes.
For new projects where the package design can be specified, they are perfect substitutes. However, for repairing or replacing components on an existing through-hole PCB, the LM358PWRG3 cannot be used directly.
Analysis ID: AE9B-3C0C000
Based on part parameters and for reference only. Not to be used for procurement or production.
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