1. Voltage and Current Rating Discrepancy: The ST part (650V/10A) is rated for higher voltage and current than the TS part (600V/7A). In applications operating near the original design limits (e.g., PFC, motor drives), the TS device risks overvoltage breakdown or thermal failure, significantly reducing system margin. 2. On-State Loss and Test Condition Discrepancy: ST's Rds(on) (430mΩ) is specified at 5A, while TS's Rds(on) (620mΩ) is specified at 2.4A. Given the positive temperature coefficient and non-linear current dependence of Rds(on), the conduction losses of the TS device at typical operating currents (e.g., 5-7A) are likely substantially higher than the nominal value, leading to reduced efficiency and increased temperature rise. 3. Thermal Performance and Power Dissipation Discrepancy: TS's specified maximum power dissipation of 46W is significantly higher than ST's 25W. This typically indicates a lower thermal resistance (RthJC) for its ITO-220 package or more optimistic manufacturer test conditions. While it has higher thermal dissipation potential, realizing this advantage depends entirely on the system's thermal design. Furthermore, its higher conduction losses will partially offset this benefit. 4. Threshold Voltage and Drive Compatibility: TS's maximum Vgs(th) (5V) is higher than ST's (4V), and its test current is larger (1mA vs. 250µA), suggesting its actual turn-on voltage may be higher. When driven by low-voltage (e.g., 5V) or weak gate drive circuits, this can lead to incomplete turn-on, increased Rds(on), and potential thermal damage.