1. Current Rating: The MURA260T3G is rated for 2A, compared to 1A for the BA158G. This provides higher current margin and improved reliability under the same operating conditions. However, if the original design relies on the 1A current‑limiting characteristic, the protection circuitry must be re‑evaluated. 2. Reverse Recovery Time: The MURA260T3G features a trr of 75ns, significantly faster than the 150ns of the BA158G. This results in lower switching losses and higher efficiency in high‑frequency applications such as switching power supplies and PFC circuits. Note that the faster turn‑off may affect voltage spike behavior in the circuit. 3. Package and Mounting: The BA158G uses a through‑hole axial lead (DO‑41) package, while the MURA260T3G is a surface‑mount device (SMA). PCB layout must be redesigned accordingly. The SMD package demands more attention to thermal management (e.g., heat dissipation through copper pours) and exhibits different mechanical stress tolerance. 4. Junction Temperature Range: The MURA260T3G offers a wider junction temperature range (–65°C to 175°C), with a higher upper limit. This makes it suitable for higher ambient temperatures or thermally constrained environments, provided the actual operating temperature and heat sinking are properly aligned. Note: Both devices share identical key parameters such as reverse voltage rating and leakage current, meeting the basic substitution requirements for equivalent voltage‑withstanding applications.