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Original Part

General Purpose Digital Isolator 2500Vrms 1 Channel 100Mbps 25kV/µs CMTI 8-SOIC (0.154", 3.90mm Width)

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Alternative Part

General Purpose Digital Isolator 3750Vrms 1 Channel 15Mbps 35kV/µs CMTI 8-SOIC (0.154", 3.90mm Width)

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General Purpose Digital Isolator 3750Vrms 1 Channel 15Mbps 35kV/µs CMTI 8-SOIC (0.154", 3.90mm Width)

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1. SI8717BC-A-IS Substitution Conclusion The SI8717BC-A-IS is not a direct drop-in replacement for the ISO721D and can only be substituted conditionally with specific performance trade-offs. The primary differences lie in the fact that the former achieves higher insulation strength (isolation voltage increased from 2500Vrms to 3750Vrms) and enhanced noise immunity (CMTI improved from 25kV/µs to 35kV/µs) at the significant expense of speed performance. This includes a reduction in data rate from 100Mbps to 15Mbps and a degradation of propagation delay and pulse width distortion by more than a factor of two. Therefore, this substitution may be considered if the application does not demand high real-time signal transmission or bandwidth (e.g., low-speed digital switching, relay driving) but requires a higher system insulation rating or improved reliability in high-noise environments. Conversely, for high-speed digital communication (e.g., UART, SPI at higher baud rates) or critical circuits extremely sensitive to signal timing consistency, this substitution will lead to substandard system performance or even functional failure.
2. SI8717BC-A-ISR Substitution Conclusion The substitution conclusion for the SI8717BC-A-ISR is identical to that of the SI8717BC-A-IS, as their core electrical parameters are exactly the same. The suffix "R" typically denotes only a reel packaging difference and does not affect the device's performance. Similarly, it cannot serve as a direct replacement for the ISO721D and is only suitable for the same low-speed, high-isolation application scenarios described above. When implementing this substitution, in addition to evaluating the aforementioned technical differences, it is necessary to verify PCB footprint and pad pattern compatibility (although both are in 8-SOIC packages, it is advisable to cross-check the detailed datasheets). Attention should also be paid to supply chain availability and cost factors.
Analysis ID: E090-689A000
Based on part parameters and for reference only. Not to be used for procurement or production.
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